公开(公告)号：US20240055331A1

公开(公告)日：2024-02-15

申请号：US17887790

申请日：2022-08-15

Applicant: Texas Instruments Incorporated

Inventor： Hau Nguyen ,  Ashok Prabhu ,  Kurt Sincerbox

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49568 ,  H01L24/73 ,  H01L24/48 ,  H01L24/32 ,  H01L23/49513 ,  H01L23/49565 ,  H01L23/49562 ,  H01L23/3135 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/561 ,  H01L2924/182 ,  H01L2224/73265 ,  H01L2224/48464 ,  H01L2224/48245 ,  H01L2224/32245

Abstract: An electronic device includes a die attach pad, a semiconductor die, a lead, a package structure, and tie bars, where the die attach pad has opposite first and second sides, the semiconductor die is attached to the second side of the die attach pad, the lead has a first portion connected to a circuit of the semiconductor die by a bond wire, the package structure exposes a portion of the first side of the die attach pad and the second portion of the lead. Four tie bars extend outward from the die attach pad and the tie bars have respective ends exposed outside the package structure.

公开(公告)号：US20200235067A1

公开(公告)日：2020-07-23

申请号：US16253680

申请日：2019-01-22

Applicant: Texas Instruments Incorporated

Inventor： Woochan Kim ,  Dibyajat Mishra ,  Kurt Sincerbox ,  Vivek Arora

IPC: H01L23/00 ,  H01L23/538 ,  H01L23/31 ,  H01L25/07 ,  H01L25/00

Abstract: A packaged electronic device includes a multilayer substrate, including a first side, a first layer having a first plurality of conductive structures along the first side, and a second layer having a second plurality of conductive structures, a semiconductor die soldered to a first set of the conductive structures, a conductive clip directly connected to one of the conductive structures of the first layer and to a second side of the semiconductor die, and a package structure that encloses the semiconductor die and a portion of the conductive clip.