A semiconductor structure, a method for manufacturing same, and a semiconductor device are provided. The semiconductor structure includes: a substrate having a groove and power supply pins; a storage module located in the groove; in which the storage module includes a plurality of storage chips stacked in a first direction, the first direction being parallel to the bottom surface of the groove; power supply signal lines being provided in each of the storage chips, and at least one of the plurality of storage chips having a power supply wiring layer electrically connected to the power supply signal lines; and conductive parts connected with the power supply wiring layer and the power supply pins.