A memory device includes a memory array die corresponding to a memory array, an access circuitry die corresponding to peripheral circuitry to support access operations with respect to the memory array, and a bonding layer disposed between the memory array die and the access circuitry die to form an interconnection between the memory array and the access circuitry. In some embodiments, the access circuitry die further integrates a local media controller corresponding to the memory array. In some embodiments, the local media controller is located external to the access circuitry die.