Invention Publication
- Patent Title: APPARATUS AND METHOD OF DETECTING WAFER EDGE USING LASER SCANNER, AND SEMICONDUCTOR TRANSFER DEVICE
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Application No.: US18135681Application Date: 2023-04-17
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Publication No.: US20240063039A1Publication Date: 2024-02-22
- Inventor: Hee Jae BYUN , Chang Rak Baek , Kyo Bong Kim , Chan Young Choi , Wan Hee Jeong , Ki Won Han , Sang Oh Kim
- Applicant: SEMES CO., LTD
- Applicant Address: KR Chungcheongnam-do
- Assignee: SEMES CO., LTD
- Current Assignee: SEMES CO., LTD
- Current Assignee Address: KR Chungcheongnam-do
- Priority: KR 20220104791 2022.08.22
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687

Abstract:
An apparatus and method of detecting a wafer edge using a laser scanner, and a semiconductor transfer device are provided. The apparatus for detecting a wafer edge using a laser scanner includes a laser scanner disposed on a rear side of a mounted wafer and radiating a laser to a portion of an edge of the wafer, and a detection unit receiving an image acquired by the laser scanner and detecting the wafer edge in the image. The detection unit determines whether each wafer is present or aligned according to wafer edges detected in a plurality of wafer areas in the image.
Information query
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