公开(公告)号：US11710654B2

公开(公告)日：2023-07-25

申请号：US17398422

申请日：2021-08-10

Applicant: SEMES CO., LTD.

Inventor： Ki Won Han ,  Byoung Doo Choi

IPC: H01L21/677 ,  H01L21/683 ,  G03F7/00 ,  G03F7/16 ,  H01L21/687

CPC classification number: H01L21/6838 ,  G03F7/162 ,  G03F7/70733 ,  H01L21/67751 ,  H01L21/68742

Abstract: A substrate transport apparatus includes transport hands that clamp substrates by vacuum pressures, respectively, and that are located at different heights, a vacuum pressure supply unit that supplies the vacuum pressures to the transport hands, and a controller that controls the vacuum pressure supply unit to supply the vacuum pressures to the transport hands or interrupt the supply of the vacuum pressures to the transport hands. The controller controls the vacuum pressure supply unit such that the vacuum pressures of the transport hands are turned off at the same height from a substrate support member.

公开(公告)号：US20240146103A1

公开(公告)日：2024-05-02

申请号：US18307092

申请日：2023-04-26

Applicant: SEMES CO., LTD.

Inventor： Chan Young Choi ,  Ki Won Han ,  Wan Hee Jeong ,  Kyo Bong Kim ,  Hee Chan Kim ,  Doo Hyun Baek ,  Sang-Oh Kim ,  Hee Jae Byun

IPC: H02J50/00 ,  H01L21/67 ,  H01L21/687 ,  H02J50/10

CPC classification number: H02J50/005 ,  H01L21/67011 ,  H01L21/68707 ,  H02J50/10

Abstract: Embodiments of the inventive concept provide a wireless power apparatus for a substrate treating apparatus and a manufacturing method for the wireless power apparatus for the substrate treating apparatus for preventing a heat generation by preventing a generation of an eddy current in a coupling element, if the coupling element is used around an outer housing at which an induced magnetic field is formed. The inventive concept provides a wireless power apparatus for a substrate treating apparatus. The wireless power apparatus includes an outer housing having a main power line forming an induced magnetic field by receiving a power, and a coupling part coupling at least two components among components which are positioned at a periphery of the main power line for fixing the main power line; and an inner housing positioned spaced apart from the outer housing, generating an electromotive force through the induced magnetic field generated from the outer housing, and supplying the electromotive force which is generated to the substrate treating apparatus, and wherein the coupling part is formed of a material at which an eddy current is not generated by the induced magnetic field.

公开(公告)号：US20240063039A1

公开(公告)日：2024-02-22

申请号：US18135681

申请日：2023-04-17

Applicant: SEMES CO., LTD

Inventor： Hee Jae BYUN ,  Chang Rak Baek ,  Kyo Bong Kim ,  Chan Young Choi ,  Wan Hee Jeong ,  Ki Won Han ,  Sang Oh Kim

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67259 ,  H01L21/68707

Abstract: An apparatus and method of detecting a wafer edge using a laser scanner, and a semiconductor transfer device are provided. The apparatus for detecting a wafer edge using a laser scanner includes a laser scanner disposed on a rear side of a mounted wafer and radiating a laser to a portion of an edge of the wafer, and a detection unit receiving an image acquired by the laser scanner and detecting the wafer edge in the image. The detection unit determines whether each wafer is present or aligned according to wafer edges detected in a plurality of wafer areas in the image.

公开(公告)号：US10923384B2

公开(公告)日：2021-02-16

申请号：US16578955

申请日：2019-09-23

Applicant: SEMES CO., LTD.

Inventor： Tae Kyung Kong ,  Ki Won Han ,  Min Je Lee

IPC: H01L21/683 ,  H01L21/677 ,  H01L21/687 ,  B25J15/06

Abstract: An apparatus for transferring a substrate includes a hand on which the substrate is placed, and the hand includes an outer support member that supports a first region of the substrate and has a pair of outer fingers, an inner support member that supports a second region of the substrate that is closer to the center of the substrate than the first region, the inner support member having a pair of inner fingers located inward of the pair of outer fingers, and a central recess formed in a region between the pair of inner fingers of the inner support member, the region corresponding to the center of the substrate placed on the hand and the central recess being open toward a front side.