Invention Publication
- Patent Title: FLAT SUBSTRATE HEATING APPARAUS USING LASER LIGHT-EMITTING DEVICE
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Application No.: US18270610Application Date: 2021-12-30
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Publication No.: US20240071788A1Publication Date: 2024-02-29
- Inventor: Hyoung June Kim , Byung Kuk Kim , Wang Jun Park , Jin Hong Lee , Nam Chun Lee
- Applicant: Viatron Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Viatron Co., Ltd.
- Current Assignee: Viatron Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Priority: KR 20200188947 2020.12.31
- International Application: PCT/KR2021/020276 2021.12.30
- Date entered country: 2023-06-30
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01S5/02315 ; H01S5/024 ; H05B3/00 ; H05B3/03

Abstract:
The present disclosure discloses a flat substrate heating apparatus including a module support plate having a plurality of unit module regions placed on an upper surface thereof; a plurality of laser light source modules having a plurality of laser light source devices and seated on unit module regions of the module support plate, respectively; a power supply board placed below the module support plate and configured to supply power to the laser light source module; and an electrode terminal electrically connecting the laser light source module and the power supply board while detachably securing them to upper and lower surfaces of the module support plate.
Information query
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