In a semiconductor integrated circuit device, an output circuit includes a first transistor connected between VSS and an output terminal. A first power line supplying VSS is formed in a buried interconnect layer, and above the buried interconnect layer, a second power line supplying VSS is formed in an M1 interconnect layer and a third power line connected to the second power line is formed in an M2 interconnect layer. A first output interconnect is formed in the M1 interconnect layer, and a second output interconnect connected to the first output interconnect is formed in the M2 interconnect layer.