Invention Publication
- Patent Title: PACKAGE COMPRISING A SUBSTRATE WITH POST INTERCONNECTS HAVING A PROFILE CROSS SECTION OF A TRAPEZOID SHAPE
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Application No.: US17939769Application Date: 2022-09-07
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Publication No.: US20240079307A1Publication Date: 2024-03-07
- Inventor: Wei WANG , Kuiwon KANG , Michelle Yejin KIM , Ahmer SYED
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48 ; H01L23/00
Abstract:
A package comprising an integrated device and a substrate coupled to the integrated device. The substrate comprises at least one dielectric layer and a plurality of interconnects. The plurality of interconnects include a plurality of post interconnects. The plurality of post interconnects include a post interconnect comprising a profile cross section that includes a trapezoid shape.
Information query
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