Invention Publication
- Patent Title: METHODS OF TSV FORMATION FOR ADVANCED PACKAGING
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Application No.: US18508801Application Date: 2023-11-14
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Publication No.: US20240087958A1Publication Date: 2024-03-14
- Inventor: Peng SUO , Ying W. WANG , Guan Huei SEE , Chang Bum YONG , Arvind SUNDARRAJAN
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L21/285 ; H01L21/288 ; H01L21/306 ; H01L21/308
Abstract:
The present disclosure relates to through-via structures with dielectric shielding of interconnections for advanced wafer level semiconductor packaging. The methods described herein enable the formation of high thickness dielectric shielding layers within low aspect ratio through-via structures, thus facilitating thin and small-form-factor package structures having high I/O density with improved bandwidth and power.
Information query
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