A semiconductor package, including a substrate extending in first direction and a second direction intersecting the first direction and including a solder resist layer having an open area thereon; a semiconductor chip on the substrate in a third direction, the third direction intersecting the first direction and the second direction, a first surface of the semiconductor chip facing the substrate; and a bump structure in contact with a first connection pad on the open area and a second connection pad on the first surface of the semiconductor chip, and configured to connect the substrate to the semiconductor chip, wherein the open area includes a first area and a second area disposed in a peripheral part of the first area, and wherein a length of the first area in the first direction is greater than a length of the second area in the first direction.