公开(公告)号：US20240088082A1

公开(公告)日：2024-03-14

申请号：US18229446

申请日：2023-08-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Ho Cha ,  Yun-Rae Cho

IPC: H01L23/00 ,  H01L23/522 ,  H01L23/544 ,  H01L25/065

CPC classification number: H01L24/17 ,  H01L23/5228 ,  H01L23/544 ,  H01L24/16 ,  H01L25/0657 ,  H01L2223/54426 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17133 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06544 ,  H01L2924/3511

Abstract: A semiconductor package, including a substrate extending in first direction and a second direction intersecting the first direction and including a solder resist layer having an open area thereon; a semiconductor chip on the substrate in a third direction, the third direction intersecting the first direction and the second direction, a first surface of the semiconductor chip facing the substrate; and a bump structure in contact with a first connection pad on the open area and a second connection pad on the first surface of the semiconductor chip, and configured to connect the substrate to the semiconductor chip, wherein the open area includes a first area and a second area disposed in a peripheral part of the first area, and wherein a length of the first area in the first direction is greater than a length of the second area in the first direction.