- 专利标题： METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
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申请号： US18262334申请日： 2022-01-21
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公开(公告)号： US20240090139A1公开(公告)日： 2024-03-14
- 发明人: Jun Ho LEE , Nam Tae CHO , Eiki TSUSHIMA
- 申请人： LX SEMICON CO., LTD. , FJ COMPOSITE MATERIALS CO., LTD.
- 申请人地址： KR Daejeon
- 专利权人： LX SEMICON CO., LTD.,FJ COMPOSITE MATERIALS CO., LTD.
- 当前专利权人： LX SEMICON CO., LTD.,FJ COMPOSITE MATERIALS CO., LTD.
- 当前专利权人地址： KR Daejeon; JP Chitose, Hokkaido
- 优先权： KR 20210008707 2021.01.21
- 国际申请： PCT/KR2022/001097 2022.01.21
- 进入国家日期： 2023-07-20
- 主分类号： H05K3/38
- IPC分类号： H05K3/38 ; C23C14/18 ; C23C14/34 ; H05K1/03 ; H05K3/02
摘要：
This application relates to a method for manufacturing a printed circuit board. According to the present application, it is possible to manufacture a printed circuit board having excellent bonding strength between a ceramic substrate and a metal sheet, and the manufacturing cost thereof can be reduced.
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