Invention Publication
- Patent Title: HOLLOW MICROBALLOON
-
Application No.: US18274188Application Date: 2022-01-27
-
Publication No.: US20240101751A1Publication Date: 2024-03-28
- Inventor: Yasutomo SHIMIZU , Kazuishi FUKUDA , Takayoshi KAWASAKI
- Applicant: TOKUYAMA CORPORATION
- Applicant Address: JP Shunan-shi, Yamaguchi
- Assignee: TOKUYAMA CORPORATION
- Current Assignee: TOKUYAMA CORPORATION
- Current Assignee Address: JP Shunan-shi, Yamaguchi
- Priority: JP 21012696 2021.01.29
- International Application: PCT/JP2022/003093 2022.01.27
- Date entered country: 2023-07-25
- Main IPC: C08G18/48
- IPC: C08G18/48 ; B24B37/24 ; C08G18/76 ; C08L29/04

Abstract:
The hollow microballoon of the invention includes a resin produced by polymerizing a polymerizing composition that contains a cyclic molecule having at least three side chains with a polymerizable functional group introduced into the terminal thereof and a polymerizable monomer other than the cyclic molecule having at least three side chains with a polymerizable functional group introduced into the terminal thereof. According to the invention, there are provided hollow microballoon capable of imparting not only polishing characteristics but also excellent durability to a CMP polishing pad using the hollow microballoon.
Information query