- 专利标题： SEMICONDUCTOR-LAMINATED SUBSTRATE, LIGHT EMITTING COMPONENT, AND MEASUREMENT APPARATUS
-
申请号： US18324994申请日： 2023-05-28
-
公开(公告)号： US20240105882A1公开(公告)日： 2024-03-28
- 发明人: Takashi KONDO , Michiaki MURATA , Saori NISHIZAKI , Takafumi HIGUCHI
- 申请人： FUJIFILM Business Innovation Corp. , FUJIFILM Corporation
- 申请人地址： JP Tokyo
- 专利权人： FUJIFILM Business Innovation Corp.,FUJIFILM Corporation
- 当前专利权人： FUJIFILM Business Innovation Corp.,FUJIFILM Corporation
- 当前专利权人地址： JP Tokyo; JP Tokyo
- 优先权： JP 22154167 2022.09.27
- 主分类号： H01L33/46
- IPC分类号： H01L33/46 ; H01L33/00 ; H01L33/06
摘要：
A semiconductor-laminated substrate includes: a substrate; and a laminated structure that includes a first semiconductor laminate which is provided on the substrate and processed into a light emitting element and a second semiconductor laminate which is provided on the first semiconductor laminate and processed into at least one thyristor, in which the laminated structure is adjusted such that two resonant wavelengths due to an effect of the thyristor are located on both sides of a resonant wavelength of the light emitting element.
信息查询
IPC分类:
