A housing of an electronic device is disclosed. A housing of an electronic device according to various embodiments of the disclosure may include: a base material containing an aluminum alloy material; a barrier layer formed by anodizing the aluminum of the base material on a surface facing a first direction of the base material, the barrier layer having a thickness of 50 to 150 nanometers; a first porous film located in the first direction with respect to the barrier layer; and a second porous film formed between the first porous film and the barrier layer.