公开(公告)号：US20240114641A1

公开(公告)日：2024-04-04

申请号：US18516224

申请日：2023-11-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byounghee CHOI ,  Giwon SEOL ,  Sunghwan YOON ,  Kangeun LEE ,  Jinho LEE ,  Doohyeon CHO ,  Youngsoo HA

IPC: H05K5/04 ,  C25D11/08 ,  C25D11/12 ,  C25D11/24

CPC classification number: H05K5/04 ,  C25D11/08 ,  C25D11/12 ,  C25D11/246

Abstract: A housing of an electronic device is disclosed. A housing of an electronic device according to various embodiments of the disclosure may include: a base material containing an aluminum alloy material; a barrier layer formed by anodizing the aluminum of the base material on a surface facing a first direction of the base material, the barrier layer having a thickness of 50 to 150 nanometers; a first porous film located in the first direction with respect to the barrier layer; and a second porous film formed between the first porous film and the barrier layer.