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公开(公告)号:US20240143039A1
公开(公告)日:2024-05-02
申请号:US18400288
申请日:2023-12-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Giwon SEOL , Jaeseon KIM , Jinho LEE , Jeongyeon JEON , Byounghee CHOI , Yongwook HWAN , Junghyeon HWANG
IPC: G06F1/16
CPC classification number: G06F1/1658 , G06F1/1635
Abstract: A plate of a housing includes a plate layer including an inner surface defining a groove which extends in an extension direction, a cut surface directly extending from the groove, a first surface roughness of the cut surface, and a second surface roughness of the inner surface which is different from the first surface roughness. The plate layer is a remaining thickness of a preliminary plate cut to remove a thickness portion thereof, the groove is a portion of a recessed pattern of the preliminary plate which is defined by the thickness portion and the remaining thickness facing each other, and the cut surface which has the first surface roughness is an exposed surface of the remaining thickness of the preliminary plate cut along a direction intersecting the extension direction of the groove to remove the thickness portion of the preliminary plate.
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公开(公告)号:US20240114641A1
公开(公告)日:2024-04-04
申请号:US18516224
申请日:2023-11-21
Applicant: Samsung Electronics Co., Ltd.
Inventor: Byounghee CHOI , Giwon SEOL , Sunghwan YOON , Kangeun LEE , Jinho LEE , Doohyeon CHO , Youngsoo HA
CPC classification number: H05K5/04 , C25D11/08 , C25D11/12 , C25D11/246
Abstract: A housing of an electronic device is disclosed. A housing of an electronic device according to various embodiments of the disclosure may include: a base material containing an aluminum alloy material; a barrier layer formed by anodizing the aluminum of the base material on a surface facing a first direction of the base material, the barrier layer having a thickness of 50 to 150 nanometers; a first porous film located in the first direction with respect to the barrier layer; and a second porous film formed between the first porous film and the barrier layer.
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