Invention Publication
- Patent Title: Copper-Coated Aluminum Wire Material and Production Method Therefor
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Application No.: US18275775Application Date: 2022-02-28
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Publication No.: US20240117483A1Publication Date: 2024-04-11
- Inventor: Akihiro KIKUCHI , Hitoshi KITAGUCHI , Yasuo IIJIMA , Kazuto HIRATA
- Applicant: NATIONAL INSTITUTE FOR MATERIALS SCIENCE
- Applicant Address: JP Tsukuba-shi, Ibaraki
- Assignee: NATIONAL INSTITUTE FOR MATERIALS SCIENCE
- Current Assignee: NATIONAL INSTITUTE FOR MATERIALS SCIENCE
- Current Assignee Address: JP Tsukuba-shi, Ibaraki
- Priority: JP 21040009 2021.03.12
- International Application: PCT/JP2022/008429 2022.02.28
- Date entered country: 2023-08-03
- Main IPC: C23C14/16
- IPC: C23C14/16 ; C23C14/02 ; C23C14/32 ; C23C14/58
Abstract:
The problem addressed by the present invention is to provide a copper-coated aluminum wire material with a reduced weight and excellent adhesiveness, and a production method therefor.
This copper-coated aluminum wire material is provided with an aluminum wire material comprising aluminum or an aluminum alloy and a thin copper film covering the aluminum wire material. The space factor of the thin copper film is in the range of 0.2% to 4% and the adhesiveness between the aluminum wire material and the thin copper film based on a scratch test compliant with JIS R 3255 is at least 10 mN.
This copper-coated aluminum wire material is provided with an aluminum wire material comprising aluminum or an aluminum alloy and a thin copper film covering the aluminum wire material. The space factor of the thin copper film is in the range of 0.2% to 4% and the adhesiveness between the aluminum wire material and the thin copper film based on a scratch test compliant with JIS R 3255 is at least 10 mN.
Information query
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