- 专利标题： Copper-Coated Aluminum Wire Material and Production Method Therefor
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申请号： US18275775申请日： 2022-02-28
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公开(公告)号： US20240117483A1公开(公告)日： 2024-04-11
- 发明人: Akihiro KIKUCHI , Hitoshi KITAGUCHI , Yasuo IIJIMA , Kazuto HIRATA
- 申请人： NATIONAL INSTITUTE FOR MATERIALS SCIENCE
- 申请人地址： JP Tsukuba-shi, Ibaraki
- 专利权人： NATIONAL INSTITUTE FOR MATERIALS SCIENCE
- 当前专利权人： NATIONAL INSTITUTE FOR MATERIALS SCIENCE
- 当前专利权人地址： JP Tsukuba-shi, Ibaraki
- 优先权： JP 21040009 2021.03.12
- 国际申请： PCT/JP2022/008429 2022.02.28
- 进入国家日期： 2023-08-03
- 主分类号： C23C14/16
- IPC分类号： C23C14/16 ; C23C14/02 ; C23C14/32 ; C23C14/58
摘要：
The problem addressed by the present invention is to provide a copper-coated aluminum wire material with a reduced weight and excellent adhesiveness, and a production method therefor.
This copper-coated aluminum wire material is provided with an aluminum wire material comprising aluminum or an aluminum alloy and a thin copper film covering the aluminum wire material. The space factor of the thin copper film is in the range of 0.2% to 4% and the adhesiveness between the aluminum wire material and the thin copper film based on a scratch test compliant with JIS R 3255 is at least 10 mN.
This copper-coated aluminum wire material is provided with an aluminum wire material comprising aluminum or an aluminum alloy and a thin copper film covering the aluminum wire material. The space factor of the thin copper film is in the range of 0.2% to 4% and the adhesiveness between the aluminum wire material and the thin copper film based on a scratch test compliant with JIS R 3255 is at least 10 mN.
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