公开(公告)号：US20240428965A1

公开(公告)日：2024-12-26

申请号：US18710851

申请日：2022-09-06

Applicant: NATIONAL INSTITUTE FOR MATERIALS SCIENCE ,  Japan Superconductivity Application Development Inc.

Inventor： Akihiro KIKUCHI ,  Yasuo IIJIMA ,  Masaru YAMAMOTO ,  Masatoshi KAWANO ,  Masato OTSUBO

IPC: H01B12/08 ,  H01F6/06

Abstract: The purpose of the present invention is to provide a niobium-aluminum precursor wire having properties such as expression of flexibility and ensuring a large single-wire length, as well as a twisted wire, a superconducting wire, and a superconducting twisted wire formed of the niobium-aluminum precursor wire. The present invention provides a niobium-aluminum precursor wire and a twisted wire using the same, the niobium-aluminum precursor wire including: a rod-like winding core (5) formed of a stabilized copper, or a stabilized copper and an unstabilized copper; a laminated body (3) that is wound around the winding core (5) and that is formed of an aluminum foil and a niobium foil laminated one on the other; and a covering body (1) that covers the circumference of the laminated body and that is formed of a stabilized copper, or a stabilized copper and an unstabilized copper. The volume ratio of the stabilized copper with respect to the unstabilized copper contained in the precursor wire is 0.5-2.0, and the volume ratios of the stabilized copper contained in the winding core (5) and the covering body (1) are within prescribed ranges. According to the present invention, a superconducting wire and a superconducting twisted wire are provided by thermally treating the precursor wire and the twisted wire.

公开(公告)号：US20210088552A1

公开(公告)日：2021-03-25

申请号：US16629963

申请日：2018-07-09

Applicant: Kyosei Co., Ltd. ,  National Institute for Materials Science

Inventor： Tsutomu SATO ,  Yoshikazu SAKAI ,  Akihiro KIKUCHI

IPC: G01R1/067 ,  C22C9/00 ,  C22C1/02 ,  C23F1/18

Abstract: The present invention focuses on a material constituting a contact pin and a processing technique of the material, and is directed to manufacturing a conductive member by using a material and a processing technique which are different from those in the related art.
The conductive member is obtained by applying etching treatment to a copper-silver alloy including copper and silver while using at least copper alloy etching liquid, but silver etching liquid may also be selectively added to the copper alloy etching liquid.

公开(公告)号：US20240117483A1

公开(公告)日：2024-04-11

申请号：US18275775

申请日：2022-02-28

Applicant: NATIONAL INSTITUTE FOR MATERIALS SCIENCE

Inventor： Akihiro KIKUCHI ,  Hitoshi KITAGUCHI ,  Yasuo IIJIMA ,  Kazuto HIRATA

IPC: C23C14/16 ,  C23C14/02 ,  C23C14/32 ,  C23C14/58

CPC classification number: C23C14/16 ,  C23C14/022 ,  C23C14/32 ,  C23C14/5806 ,  C23C14/5886

Abstract: The problem addressed by the present invention is to provide a copper-coated aluminum wire material with a reduced weight and excellent adhesiveness, and a production method therefor.
This copper-coated aluminum wire material is provided with an aluminum wire material comprising aluminum or an aluminum alloy and a thin copper film covering the aluminum wire material. The space factor of the thin copper film is in the range of 0.2% to 4% and the adhesiveness between the aluminum wire material and the thin copper film based on a scratch test compliant with JIS R 3255 is at least 10 mN.