公开(公告)号：US20240117483A1

公开(公告)日：2024-04-11

申请号：US18275775

申请日：2022-02-28

Applicant: NATIONAL INSTITUTE FOR MATERIALS SCIENCE

Inventor： Akihiro KIKUCHI ,  Hitoshi KITAGUCHI ,  Yasuo IIJIMA ,  Kazuto HIRATA

IPC: C23C14/16 ,  C23C14/02 ,  C23C14/32 ,  C23C14/58

CPC classification number: C23C14/16 ,  C23C14/022 ,  C23C14/32 ,  C23C14/5806 ,  C23C14/5886

Abstract: The problem addressed by the present invention is to provide a copper-coated aluminum wire material with a reduced weight and excellent adhesiveness, and a production method therefor.
This copper-coated aluminum wire material is provided with an aluminum wire material comprising aluminum or an aluminum alloy and a thin copper film covering the aluminum wire material. The space factor of the thin copper film is in the range of 0.2% to 4% and the adhesiveness between the aluminum wire material and the thin copper film based on a scratch test compliant with JIS R 3255 is at least 10 mN.