Invention Publication
- Patent Title: DIELECTRIC ON DIELECTRIC SELECTIVE DEPOSITION USING ANILINE PASSIVATION
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Application No.: US17960979Application Date: 2022-10-06
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Publication No.: US20240120195A1Publication Date: 2024-04-11
- Inventor: Keith T. Wong , Srinivas D. Nemani , Ellie Y. Yieh , Andrew C. Kummel , Yunil Cho , James Huang
- Applicant: Applied Materials, Inc. , Regents of the University of California
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.,Regents of the University of California
- Current Assignee: Applied Materials, Inc.,Regents of the University of California
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/67
Abstract:
A method includes forming a conductive material on a first dielectric layer, exposing the conductive material to aniline to produce a passivated surface of the conductive material, and after exposing the conductive material to aniline, forming a second dielectric layer on the first dielectric layer using a deposition process. The deposition process is a water-free and plasma-free deposition process, and the second dielectric layer does not form on the passivated surface of the conductive material.
Information query
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