Invention Publication
- Patent Title: POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES
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Application No.: US18542230Application Date: 2023-12-15
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Publication No.: US20240120328A1Publication Date: 2024-04-11
- Inventor: Jerome TEYSSEYRE , Inpil YOO , Jooyang EOM
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Scottsdale
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Scottsdale
- The original application number of the division: US16949896 2020.11.19
- Main IPC: H01L25/00
- IPC: H01L25/00 ; H01L23/367 ; H01L23/467 ; H01L23/473 ; H01L25/07 ; H01L25/18

Abstract:
According to an aspect, a power module package includes a plurality of power modules including a first power module and a second power module, a plurality of heat sinks including a first heat sink coupled to the first power module and a second heat sink coupled to the second power module, and a module carrier coupled to the plurality of power modules, where the module carrier includes a first region defining a first heat-sink slot and a second region defining a second heat-sink slot. The first heat sink extends at least partially through the first heat-sink slot and the second heat sink extends at least partially through the second heat-sink slot. The power module package includes a housing coupled to the module carrier and a ring member located between the module carrier and the housing.
Information query
IPC分类: