Invention Publication
- Patent Title: TREATMENT LIQUID, METHOD FOR WASHING SUBSTRATE, AND METHOD FOR REMOVING RESIST
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Application No.: US18400807Application Date: 2023-12-29
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Publication No.: US20240134284A1Publication Date: 2024-04-25
- Inventor: Tomonori TAKAHASHI , Tetsuya KAMIMURA
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP 16112011 2016.06.02
- Main IPC: G03F7/42
- IPC: G03F7/42 ; C11D3/00 ; C11D7/04 ; C11D7/20 ; C11D7/26 ; C11D7/32 ; C11D7/34 ; C11D7/50 ; H01L21/02
Abstract:
A treatment liquid for a semiconductor device includes an alkanolamine; a hydroxylamine; an organic solvent; Ca; Fe; and Na, wherein the content of the alkanolamine in the treatment liquid is 0.1% to 5% by mass, the content of the hydroxylamine in the treatment liquid is 0.1% to 30% by mass, and each of the mass ratio of Ca, Fe, and Na with respect to the content of the alkanolamine and the hydroxylamine in the treatment liquid is 10−12 to 10−4.
Public/Granted literature
- US20240231237A9 TREATMENT LIQUID, METHOD FOR WASHING SUBSTRATE, AND METHOD FOR REMOVING RESIST Public/Granted day:2024-07-11
Information query
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