Invention Publication
- Patent Title: Semiconductor Device and Method of Making a Substrate with Improved Substrate Mounting Apparatus
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Application No.: US18490741Application Date: 2023-10-18
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Publication No.: US20240136217A1Publication Date: 2024-04-25
- Inventor: Hua Hong Tan , Chee Kay Chow , Zong Xiang Cai , Wei Ming Xian , Yao Hong Wu , Wing Keung Lam
- Applicant: UTAC Headquarters Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: UTAC Headquarters Pte. Ltd.
- Current Assignee: UTAC Headquarters Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/48 ; H01L21/67 ; H01L21/677

Abstract:
A manufacturing system includes a substrate disposed on a conveyer system. The conveyer system includes a pair of side supports. The substrate is moved on the conveyer system until the substrate is disposed over a bottom support block. The bottom support block is raised to physically contact the substrate. A transfer arm module is provided. The transfer arm module includes a flat bottom surface and an opening formed in the flat bottom surface. The transfer arm module is disposed with the flat bottom surface physically contacting the substrate opposite the bottom support block. A vacuum is enabled through the opening of the transfer arm module. The substrate is lifted off the bottom support block using the vacuum. The substrate is moved over a printing pallet using the transfer arm module. The vacuum is disabled when the substrate is in a positioning area of the printing pallet.
Public/Granted literature
- US20240234195A9 Semiconductor Device and Method of Making a Substrate with Improved Substrate Mounting Apparatus Public/Granted day:2024-07-11
Information query
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