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1.发明公开公开(公告)号：US20240136217A1
公开(公告)日：2024-04-25
申请号：US18490741
申请日：2023-10-18
发明人： Hua Hong Tan , Chee Kay Chow , Zong Xiang Cai , Wei Ming Xian , Yao Hong Wu , Wing Keung Lam
IPC分类号： H01L21/683 , H01L21/48 , H01L21/67 , H01L21/677
CPC分类号： H01L21/6838 , H01L21/4867 , H01L21/6715 , H01L21/67259 , H01L21/67736 , H01L21/67742 , H01L21/67766
摘要： A manufacturing system includes a substrate disposed on a conveyer system. The conveyer system includes a pair of side supports. The substrate is moved on the conveyer system until the substrate is disposed over a bottom support block. The bottom support block is raised to physically contact the substrate. A transfer arm module is provided. The transfer arm module includes a flat bottom surface and an opening formed in the flat bottom surface. The transfer arm module is disposed with the flat bottom surface physically contacting the substrate opposite the bottom support block. A vacuum is enabled through the opening of the transfer arm module. The substrate is lifted off the bottom support block using the vacuum. The substrate is moved over a printing pallet using the transfer arm module. The vacuum is disabled when the substrate is in a positioning area of the printing pallet.
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2.发明公开公开(公告)号：US20240234195A9
公开(公告)日：2024-07-11
申请号：US18490741
申请日：2023-10-19
发明人： Hua Hong Tan , Chee Kay Chow , Zong Xiang Cai , Wei Ming Xian , Yao Hong Wu , Wing Keung Lam
IPC分类号： H01L21/683 , H01L21/48 , H01L21/67 , H01L21/677
CPC分类号： H01L21/6838 , H01L21/4867 , H01L21/6715 , H01L21/67259 , H01L21/67736 , H01L21/67742 , H01L21/67766
摘要： A manufacturing system includes a substrate disposed on a conveyer system. The conveyer system includes a pair of side supports. The substrate is moved on the conveyer system until the substrate is disposed over a bottom support block. The bottom support block is raised to physically contact the substrate. A transfer arm module is provided. The transfer arm module includes a flat bottom surface and an opening formed in the flat bottom surface. The transfer arm module is disposed with the flat bottom surface physically contacting the substrate opposite the bottom support block. A vacuum is enabled through the opening of the transfer arm module. The substrate is lifted off the bottom support block using the vacuum. The substrate is moved over a printing pallet using the transfer arm module. The vacuum is disabled when the substrate is in a positioning area of the printing pallet.
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公开(公告)号：US20230058682A1
公开(公告)日：2023-02-23
申请号：US17454514
申请日：2021-11-11
发明人： Hua Hong Tan , Wing Keung Lam , Zong Xiang Cai , Wei Ming Xian , Yao Hong Wu , Tao Hu
摘要： A semiconductor manufacturing equipment cleaning system has a multi-station cleaning and inspection system. Within semiconductor manufacturing equipment cleaning system, a tray cleaning station uses a first rotating brush passing over a first surface of a carrier and possibly semiconductor die, and a second rotating brush passing over a second surface of the carrier and semiconductor die opposite the first surface of the carrier and semiconductor die. Debris and contaminants dislodged from the first surface and second surface of the carrier by the first rotating brush and second rotating brush are removed under vacuum suction. A conveyor transports the carrier through the multi-station cleaning and inspection system. The first rotating brush and second rotating brush move in tandem across the first surface and second surface of the carrier. Air pressure is injected across the first rotating brush and second rotating brush to further remove debris and contaminants.
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公开(公告)号：US11945004B2
公开(公告)日：2024-04-02
申请号：US17454514
申请日：2021-11-11
发明人： Hua Hong Tan , Wing Keung Lam , Zong Xiang Cai , Wei Ming Xian , Yao Hong Wu , Tao Hu
摘要： A semiconductor manufacturing equipment cleaning system has a multi-station cleaning and inspection system. Within semiconductor manufacturing equipment cleaning system, a tray cleaning station uses a first rotating brush passing over a first surface of a carrier and possibly semiconductor die, and a second rotating brush passing over a second surface of the carrier and semiconductor die opposite the first surface of the carrier and semiconductor die. Debris and contaminants dislodged from the first surface and second surface of the carrier by the first rotating brush and second rotating brush are removed under vacuum suction. A conveyor transports the carrier through the multi-station cleaning and inspection system. The first rotating brush and second rotating brush move in tandem across the first surface and second surface of the carrier. Air pressure is injected across the first rotating brush and second rotating brush to further remove debris and contaminants.
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