Invention Publication
- Patent Title: MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
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Application No.: US18400761Application Date: 2023-12-29
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Publication No.: US20240136292A1Publication Date: 2024-04-25
- Inventor: Omkar G. Karhade , Edvin Cetegen , Anurag Tripathi , Nitin A. Deshpande
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L21/48 ; H01L21/56 ; H01L23/00 ; H01L23/31
Abstract:
Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.
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