A composite electronic component includes circuit layers, each including an electronic component, that are laminated, first and second circuit layers, a ceramic electronic component between the first and second circuit layers and including via electrodes extending through a body mainly including ceramic and being exposed at a corresponding one of a main surface on one side and a main surface on another side, and a sealing resin covering at least the ceramic electronic component at a location between the first and second circuit layers. At least one electronic component included in each of the first and second circuit layers are electrically connected by the via electrodes.