公开(公告)号：US20240155821A1

公开(公告)日：2024-05-09

申请号：US18503663

申请日：2023-11-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshiaki SATAKE ,  Masayuki AOIKE ,  Tatsuya FUNAKI

IPC: H05K13/00 ,  H05K13/04 ,  H05K13/08

CPC classification number: H05K13/0015 ,  H05K13/0409 ,  H05K13/0812 ,  H05K13/0818

Abstract: A mounting nozzle is capable of holding an electronic component having multiple patterns provided on its pattern surface based on pattern design information. A camera is capable of capturing an image of the pattern surface of the electronic component. A movement mechanism is capable of moving the mounting nozzle between a location where capturing of the image by the camera is performed and a component mounting location. A control unit is capable of controlling the mounting nozzle and the movement mechanism. The control unit stores positional relationship information indicating positional relationship based on the pattern design information between a position of a registration pattern representative point identified by at least one registration pattern selected from the multiple patterns provided on the pattern surface and a position of a positioning reference point on which positioning of the electronic component at the component mounting location for mounting is based.

公开(公告)号：US20210304963A1

公开(公告)日：2021-09-30

申请号：US17344666

申请日：2021-06-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takehito ISHIHARA ,  Tatsuya FUNAKI ,  Haruhiko IKEDA

IPC: H01G4/005 ,  H01G4/224

Abstract: An electrode-equipped passive component is an electrode-equipped passive component to be mounted on a mount target, and includes a passive component main body, an electrode provided on a mount surface of the passive component main body, and an underfill layer provided on the mount surface of the passive component main body. The underfill layer includes a thermosetting resin, a flux, and a solvent, and has a surface having a skin layer. The skin layer has tack power equal to or smaller than 25 mN/mm2 at room temperature and equal to or larger than 60 mN/mm2 at 40° C.

公开(公告)号：US20240136268A1

公开(公告)日：2024-04-25

申请号：US18399324

申请日：2023-12-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshiaki SATAKE ,  Tatsuya FUNAKI ,  Kei ARAI

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/13 ,  H01L23/31

CPC classification number: H01L23/49827 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L21/561 ,  H01L24/83 ,  H01L2224/29191 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/83862 ,  H01L2224/95 ,  H01L2924/0715

Abstract: A composite component includes an Si base layer that has first and second main surfaces that are opposite to each other, a rerouting layer on the first main surface, a through-silicon via that is electrically connected to the rerouting layer, and that extends through the Si base layer, and an electronic component layer on the second main surface of the Si base layer, and that includes electronic components each including an electronic component body and a component electrode on the electronic component body. The component electrode is connected to the through-silicon via. One or more of the electronic components have a curved shape that is curved to protrude in a mount direction in a cross-sectional view. A mount surface of the composite component corresponds to the curved shape in a cross-sectional view, and includes one or more first curved surfaces that are curved to protrude in the mount direction.

公开(公告)号：US20250149423A1

公开(公告)日：2025-05-08

申请号：US19018263

申请日：2025-01-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tatsuya FUNAKI

IPC: H01L23/498 ,  H01L21/304 ,  H01L21/683 ,  H01L21/768 ,  H01L23/48

Abstract: A composite component device including two or more composite component layers having an electronic component layer and a rewiring layer on the electronic component layer. The two or more composite component layers are laminated in a thickness direction such that the electronic component layer and the rewiring layer are alternately disposed, and the electronic component layer has one or more electronic components having an electronic component main body having a first surface perpendicular to the thickness direction and a second surface opposed to the first surface; and component electrodes on the first surface. The component electrode of the one or more electronic components is electrically connected to the rewiring layer, and an electronic component layer in a composite component layer adjacent to the rewiring layer of two or more composite component layers has an electronic component layer through-via electrically connected to the rewiring layer of another composite component layer.

公开(公告)号：US20240234389A9

公开(公告)日：2024-07-11

申请号：US18404939

申请日：2024-01-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yukihiro FUJITA ,  Ryutaro YAMATO ,  Tatsuya FUNAKI ,  Yoshiaki SATAKE

IPC: H01L25/10 ,  H01L23/15 ,  H01L23/528 ,  H01L23/538 ,  H01L23/64

CPC classification number: H01L25/105 ,  H01L23/15 ,  H01L23/528 ,  H01L23/5384 ,  H01L23/642

Abstract: A composite electronic component includes circuit layers, each including an electronic component, that are laminated, first and second circuit layers, a ceramic electronic component between the first and second circuit layers and including via electrodes extending through a body mainly including ceramic and being exposed at a corresponding one of a main surface on one side and a main surface on another side, and a sealing resin covering at least the ceramic electronic component at a location between the first and second circuit layers. At least one electronic component included in each of the first and second circuit layers are electrically connected by the via electrodes.

公开(公告)号：US20240136342A1

公开(公告)日：2024-04-25

申请号：US18404939

申请日：2024-01-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yukihiro FUJITA ,  Ryutaro YAMATO ,  Tatsuya FUNAKI ,  Yoshiaki SATAKE

IPC: H01L25/10 ,  H01L23/15 ,  H01L23/528 ,  H01L23/538 ,  H01L23/64

CPC classification number: H01L25/105 ,  H01L23/15 ,  H01L23/528 ,  H01L23/5384 ,  H01L23/642

Abstract: A composite electronic component includes circuit layers, each including an electronic component, that are laminated, first and second circuit layers, a ceramic electronic component between the first and second circuit layers and including via electrodes extending through a body mainly including ceramic and being exposed at a corresponding one of a main surface on one side and a main surface on another side, and a sealing resin covering at least the ceramic electronic component at a location between the first and second circuit layers. At least one electronic component included in each of the first and second circuit layers are electrically connected by the via electrodes.

公开(公告)号：US20230352388A1

公开(公告)日：2023-11-02

申请号：US18321417

申请日：2023-05-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshiaki SATAKE ,  Tatsuya FUNAKI

IPC: H01L23/498 ,  H01L23/14 ,  H01L21/768 ,  H01L23/06

CPC classification number: H01L23/49827 ,  H01L23/147 ,  H01L21/76873 ,  H01L23/06

Abstract: A composite component includes an interposer structure and an electronic component. The interposer structure has a Si base layer having a first main surface and a second main surface opposite to each other, a redistribution layer formed on the first main surface, through-Si vias electrically connected to the redistribution layer and penetrating the Si base layer, an interposer electrode facing the second main surface, an adhesive layer and an insulating layer. The electronic component has component electrodes respectively connected to the through-Si vias. The electronic component is provided between the interposer electrode and the Si base layer. The insulating layer is disposed between the component electrodes of the electronic component. In the electronic component, the component electrode and a surface on which the insulating layer is disposed are bonded to the second main surface of the Si base layer with the adhesive layer interposed therebetween.

公开(公告)号：US20210398730A1

公开(公告)日：2021-12-23

申请号：US17350624

申请日：2021-06-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshimasa YOSHIOKA ,  Tatsuya FUNAKI ,  Shunsuke ABE

IPC: H01F27/06 ,  H01F27/28 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

Abstract: A surface-mount passive component includes a passive element and a size conversion unit on which the passive element is mounted. The size conversion unit has a body, a plurality of first external terminals each of which is exposed on an element mount surface of the body and is electrically connected to a corresponding one of passive element external terminals of the passive element, a plurality of second external terminals exposed on a board-side mount surface of the body, and connection wires that electrically connect the first external terminals and the second external terminals. An area of the board-side mount surface is larger than an area of a first main surface of the passive element, and a total area of the plurality of second external terminals on the board-side mount surface is larger than a total area of the passive element external terminals on the first main surface.