Invention Publication
- Patent Title: BENZYL COMPOUND PASSIVATION FOR SELECTIVE DEPOSITION AND SELECTIVE ETCH PROTECTION
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Application No.: US17976440Application Date: 2022-10-28
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Publication No.: US20240145232A1Publication Date: 2024-05-02
- Inventor: Feng Q. Liu , Mark J. Saly , David Thompson
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L21/02
- IPC: H01L21/02 ; C23C16/02 ; C23C16/34 ; C23C16/40 ; C23C16/455
Abstract:
A method includes forming a first layer and a second layer on a substrate, forming a passivation layer on a surface of the first layer without forming the passivation layer on a surface of the second layer by exposing the first layer and the second layer to a benzyl compound, and after forming the passivation layer on the first layer, performing at least one of: depositing a third layer on the second layer, or etching the second layer.
Information query
IPC分类:
