Invention Publication
- Patent Title: WORKPIECE HANDLING ARCHITECTURE FOR HIGH WORKPIECE THROUGHPUT
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Application No.: US17977422Application Date: 2022-10-31
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Publication No.: US20240145271A1Publication Date: 2024-05-02
- Inventor: Jason M. Schaller , Michael Carrell , William T. Weaver , Charles T. Carlson
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677 ; H01L21/687
Abstract:
A system for transferring semiconductor workpieces from a load lock to an orientation station and onto a platen is disclosed. The system comprises two load locks, a multi-workpiece orientation station, two multi-pick robots that transfer a plurality of workpieces between a respective load lock and the multi-workpiece orientation station, and two backend robots that transfer individual workpieces between the multi-workpiece orientation station and the platen.
Information query
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