- 专利标题: SUBSTRATE PROCESSING APPARATUS
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申请号: US18500087申请日: 2023-11-01
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公开(公告)号: US20240150500A1公开(公告)日: 2024-05-09
- 发明人: Tatsuya YAMAGUCHI , Syuji NOZAWA
- 申请人: TOKYO ELECTRON LIMITED
- 申请人地址: JP Tokyo
- 专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人地址: JP Tokyo
- 优先权: JP 22179529 2022.11.09
- 主分类号: C08F2/34
- IPC分类号: C08F2/34 ; C08F2/00 ; C08G85/00
摘要:
A substrate processing apparatus includes a processing container; a stage on which a substrate is placed, the stage being provided in the processing container; a gas supply provided at a position facing the stage and configured to supply a first processing gas containing a first monomer and a second processing gas containing a second monomer into the processing container to form a film of a polymer on the substrate; and a driver configured to move the stage so as to change a distance between the gas supply and the stage. The gas supply is configured to supply the first processing gas and the second processing gas into a space between the gas supply and the stage from an outside of a region on the stage in which the substrate is placed, when viewed in a direction from the gas supply toward the stage.
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