Invention Publication
- Patent Title: BACKSIDE CONTACT STRUCTURES AND FABRICATION FOR METAL ON BOTH SIDES OF DEVICES
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Application No.: US18415251Application Date: 2024-01-17
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Publication No.: US20240154011A1Publication Date: 2024-05-09
- Inventor: Patrick MORROW , Rishabh MEHANDRU , Aaron D. LILAK , Kimin JUN
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- The original application number of the division: US15747119 2018.01.23
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L21/8234 ; H01L27/12 ; H01L29/08 ; H01L29/40 ; H01L29/423 ; H01L29/66 ; H01L29/78

Abstract:
An apparatus including a circuit structure including a device stratum including a plurality of devices including a first side and an opposite second side; and a metal interconnect coupled to at least one of the plurality of devices from the second side of the device stratum. A method including forming a transistor device including a channel between a source region and a drain region and a gate electrode on the channel defining a first side of the device; and forming an interconnect to one of the source region and the drain region from a second side of the device.
Public/Granted literature
- US12288810B2 Backside contact structures and fabrication for metal on both sides of devices Public/Granted day:2025-04-29
Information query
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