A physical vapor deposition (PVD) chamber deposits thin films on substrates having through-vias (TVs) formed therethrough in an electronic device fabrication process. More particularly, apparatus and methods improve film deposition uniformity when the TVs have a high aspect ratio or are otherwise shaped in a manner that can decrease the deposition of sputtered material. A sacrificial plate is used below the substrate in a manner whereby material is sputtered into the TVs from below in addition to the conventional top-down sputtering.