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公开(公告)号：US20240332058A1
公开(公告)日：2024-10-03
申请号：US18436846
申请日：2024-02-08
Applicant: Applied Materials, Inc.
Inventor： Sathiyamurthi GOVINDASAMY , Harish PENMETHSA , Suresh PALANISAMY
IPC: H01L21/687
CPC classification number: H01L21/68742
Abstract: A support assembly for supporting a substrate in a processing station includes a housing, a pin, a plurality of bearing elements, and a retaining member. The housing includes a bore, a groove formed on an exterior surface of the housing, and a plurality of windows disposed in the groove that intersect the bore. The pin is disposed in the bore and moveable between a retracted position and an extended position. The pin includes a shaft including a plurality of bearing surfaces. The plurality of bearing elements are at least partially disposed in a corresponding window. Each bearing element includes an outer surface configured to engage a corresponding bearing surface of the shaft. The plurality of bearing elements and bearing surfaces cooperate to maintain an angular orientation of the pin as the pin moves between the retracted position and the extended position. The retaining member is disposed in the groove.
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公开(公告)号：US20230130947A1
公开(公告)日：2023-04-27
申请号：US17507252
申请日：2021-10-21
Applicant: Applied Materials, Inc.
Inventor： Harish PENMETHSA , Hong S. YANG , Suresh PALANISAMY
Abstract: Apparatus and methods for improving film uniformity in a physical vapor deposition (PVD) process are provided herein. In some embodiments, a PVD chamber includes a pedestal disposed within a processing region of the PVD chamber, the pedestal having an upper surface configured to support a substrate thereon, a first motor coupled to the pedestal, a lid assembly comprising a first target, a first magnetron disposed over a portion of the first target, and in a region of the lid assembly that is maintained at atmospheric pressure, a first actuator configured to translate the first magnetron in a first direction, a second actuator configured to translate the first magnetron in a second direction, and a system controller that is configured to cause the first magnetron to translate along at least a portion of a first path by causing the first actuator and second actuator to simultaneously translate the first magnetron.
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公开(公告)号：US20240170269A1
公开(公告)日：2024-05-23
申请号：US17990536
申请日：2022-11-18
Applicant: Applied Materials, Inc.
Inventor： Harish PENMETHSA
CPC classification number: H01J37/3426 , C23C14/35 , H01J37/32082 , H01J37/3244 , H01J37/32715 , H01J37/3405 , H01J37/3455 , H01J37/347 , H01J2237/2007 , H01J2237/20207 , H01J2237/20214 , H01J2237/332
Abstract: A physical vapor deposition (PVD) chamber deposits thin films on substrates having through-vias (TVs) formed therethrough in an electronic device fabrication process. More particularly, apparatus and methods improve film deposition uniformity when the TVs have a high aspect ratio or are otherwise shaped in a manner that can decrease the deposition of sputtered material. A sacrificial plate is used below the substrate in a manner whereby material is sputtered into the TVs from below in addition to the conventional top-down sputtering.
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公开(公告)号：US20240167147A1
公开(公告)日：2024-05-23
申请号：US17990527
申请日：2022-11-18
Applicant: Applied Materials, Inc.
Inventor： Harish PENMETHSA
CPC classification number: C23C14/228 , C23C14/14 , C23C14/50
Abstract: A physical vapor deposition (PVD) chamber deposits thin films on substrates having through-vias (TVs) formed therethrough in an electronic device fabrication process. More particularly, apparatus and methods improve film deposition uniformity when the TVs have a high aspect ratio or are otherwise shaped in a manner that can decrease the deposition of sputtered material. A sacrificial plate is used below the substrate in a manner whereby material is sputtered into the TVs from below in addition to the conventional top-down sputtering.
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