Invention Publication
- Patent Title: PHOTORESIST COMPOSITION FOR EXTREME ULTRAVIOLET, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
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Application No.: US18377365Application Date: 2023-10-06
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Publication No.: US20240168381A1Publication Date: 2024-05-23
- Inventor: Jincheol PARK , Seonghyeon AHN , Honggu IM , Sungmin KO , Juyoung KIM , Juhyeon PARK , Naery YU
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20220146389 2022.11.04
- Main IPC: G03F7/022
- IPC: G03F7/022 ; G03F7/004 ; G03F7/20
Abstract:
A photoresist composition for extreme ultraviolet (EUV) radiation and a method of manufacturing a semiconductor device, the photoresist composition includes a polymer resin; a photoacid generator; and a photoreactive additive that includes at least two diazonaphthoquinone (DNQ) groups, wherein the at least two DNQ groups are represented by Formula 1 or Formula 2 described herein.
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