Invention Publication
- Patent Title: High Heat Capacity Hot Plate
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Application No.: US17989333Application Date: 2022-11-17
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Publication No.: US20240170307A1Publication Date: 2024-05-23
- Inventor: Hoyoung Kang
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687
Abstract:
According to an embodiment, an apparatus for a hot plate apparatus is disclosed. The hot plate apparatus includes a housing structure, an alloy, and a heating element. The housing structure includes an outer shell surrounding a cavity. The alloy is disposed of within the cavity. The alloy has a melting temperature range. The heating element is configured to transition the alloy from a solid state to a liquid state at a set temperature between the melting temperature range.
Information query
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