- 专利标题： SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
-
申请号： US18422166申请日： 2024-01-25
-
公开(公告)号： US20240170360A1公开(公告)日： 2024-05-23
- 发明人: Chun-Yin LIN , Yu-Jin LI , Tai-Yu CHEN , Pu-Shan HUANG
- 申请人： MEDIATEK Inc.
- 申请人地址： TW Hsin-Chu
- 专利权人： MEDIATEK Inc.
- 当前专利权人： MEDIATEK Inc.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L23/367
- IPC分类号： H01L23/367 ; H01L23/00
摘要：
A semiconductor device includes a substrate, an electronic component, a cover and a liquid metal. The electronic component is disposed on the substrate. The cover is disposed on the substrate, coves the electronic component and has a recess. The liquid metal is formed between the recess and the electronic component.
信息查询
IPC分类:
