公开(公告)号：US20240321674A1

公开(公告)日：2024-09-26

申请号：US18510825

申请日：2023-11-16

Applicant: MEDIATEK INC.

Inventor： Pu-Shan HUANG ,  Chi-Yuan CHEN ,  Shih-Chin LIN

IPC: H01L23/367 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1611 ,  H01L2924/1632

Abstract: A semiconductor device is provided. The semiconductor device includes a substrate, a semiconductor die, a lid, a liquid metal, a gel and a thermal dissipation structure. The semiconductor die is disposed on the substrate. The lid is disposed on the substrate and covers the semiconductor die. The lid has an opening to expose the semiconductor die. The liquid metal is disposed on the semiconductor die. The gel is disposed between the semiconductor die and the lid. The thermal dissipation structure is disposed on the lid and covers the opening. The semiconductor die, the gel and the thermal dissipation structure form a closed space for accommodating the liquid metal.

公开(公告)号：US20240170360A1

公开(公告)日：2024-05-23

申请号：US18422166

申请日：2024-01-25

Applicant: MEDIATEK Inc.

Inventor： Chun-Yin LIN ,  Yu-Jin LI ,  Tai-Yu CHEN ,  Pu-Shan HUANG

IPC: H01L23/367 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/05644 ,  H01L2224/16225 ,  H01L2224/29012 ,  H01L2224/29035 ,  H01L2224/32225 ,  H01L2224/32257 ,  H01L2224/33055 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83104

Abstract: A semiconductor device includes a substrate, an electronic component, a cover and a liquid metal. The electronic component is disposed on the substrate. The cover is disposed on the substrate, coves the electronic component and has a recess. The liquid metal is formed between the recess and the electronic component.

公开(公告)号：US20240145350A1

公开(公告)日：2024-05-02

申请号：US18475318

申请日：2023-09-27

Applicant: MEDIATEK Inc.

Inventor： Pu-Shan HUANG ,  Chi-Yuan CHEN ,  Shih-Chin LIN

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/16

CPC classification number: H01L23/4952 ,  H01L21/4885 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49513 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48155 ,  H01L2224/48225 ,  H01L2224/73265 ,  H01L2924/19101

Abstract: A semiconductor device is provided. The semiconductor device includes a carrier, an electronic component, an adapter, a first metal wire and a second metal wire. The electronic component is disposed on the carrier. The adapter is disposed on the carrier. The first metal wire connects the electronic component and the adapter. The second metal wire connects the adapter and the carrier.