公开(公告)号：US20240170360A1

公开(公告)日：2024-05-23

申请号：US18422166

申请日：2024-01-25

申请人： MEDIATEK Inc.

发明人： Chun-Yin LIN ,  Yu-Jin LI ,  Tai-Yu CHEN ,  Pu-Shan HUANG

IPC分类号： H01L23/367 ,  H01L23/00

CPC分类号： H01L23/3675 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/05644 ,  H01L2224/16225 ,  H01L2224/29012 ,  H01L2224/29035 ,  H01L2224/32225 ,  H01L2224/32257 ,  H01L2224/33055 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83104

摘要： A semiconductor device includes a substrate, an electronic component, a cover and a liquid metal. The electronic component is disposed on the substrate. The cover is disposed on the substrate, coves the electronic component and has a recess. The liquid metal is formed between the recess and the electronic component.

公开(公告)号：US20230197667A1

公开(公告)日：2023-06-22

申请号：US18172409

申请日：2023-02-22

申请人： MEDIATEK Inc.

发明人： Yu-Jin LI ,  Bo-Jiun YANG ,  Tai-Yu CHEN ,  Tsung-Yu PAN ,  Chun-Yin LIN

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L21/48 ,  H01L21/56

CPC分类号： H01L24/32 ,  H01L23/3107 ,  H01L23/373 ,  H01L24/16 ,  H01L21/4871 ,  H01L21/56 ,  H01L23/49816

摘要： A semiconductor device includes a substrate, an electronic component, a cover, a heat conduction component and a dam. The electronic component is disposed on the substrate. The cover is disposed on the substrate and covers the electronic component. The heat conduction component is disposed between the electronic component and the cover. The dam is disposed between the electronic component and the cover and surrounds the heat conduction component.