Invention Publication
- Patent Title: OVERMOLDED LEAD FRAME PROVIDING CONTACT SUPPORT AND IMPEDANCE MATCHING PROPERTIES
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Application No.: US18425168Application Date: 2024-01-29
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Publication No.: US20240170895A1Publication Date: 2024-05-23
- Inventor: John A. MONGOLD , Jonathan E. BUCK
- Applicant: Samtec, Inc.
- Applicant Address: US IN New Albany
- Assignee: Samtec, Inc.
- Current Assignee: Samtec, Inc.
- Current Assignee Address: US IN New Albany
- Main IPC: H01R13/6477
- IPC: H01R13/6477 ; H01R12/72 ; H01R13/41 ; H01R13/514 ; H01R13/631 ; H01R13/646 ; H03H7/38

Abstract:
An electrical connector includes first and second adjacent electrical contacts that each define respective first and second mating ends, the first mating end of a first one of the first and second adjacent electrical contacts defines a first contact surface, the second mating end of a second one of the first and second adjacent electrical contacts defines a second contact surface electrically isolated from the first contact surface; and a dielectric material positioned between the first and second adjacent electrical contacts. When a mating connector applies a force to the first contact surface and the second contact surface, the first and second mating ends and the dielectric material all move in a first direction.
Public/Granted literature
- US12176656B2 Overmolded lead frame providing contact support and impedance matching properties Public/Granted day:2024-12-24
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