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公开(公告)号:US20230156953A1
公开(公告)日:2023-05-18
申请号:US17917659
申请日:2021-04-07
Applicant: Samtec, Inc.
Inventor: Burrell G. BEST , Brian R. VICICH , Kevin R. MEREDITH , Chadrick P. FAITH , Istvan NOVAK , Jonathan E. BUCK
CPC classification number: H05K7/1461 , H05K9/0018 , H01F27/36 , H05K1/0209 , H01R12/737 , H01R12/721
Abstract: A substrate reinforcement or stiffener can be toolless, slide-on, slide-off, and removable. A hold down can carry pre-attached solder balls, solder units, or fusible elements. Fusible elements can be shaped to reduce thermal and mechanical stresses when reflowed onto a substrate. A heat-producing article can include a heat-dissipation material selectively located on, or immediately adjacent to, a heat-producing article. Clips with a plurality of fingers can be added to power conductors. Graphene strips, graphene coatings, or nanomaterials can be applied to electrically non-conductive articles and are able to selectively direct unwanted heat away from the heat-producing article. Electro-magnetic interference can be reduced by selective placement of voids in a shield of an electrical component.
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公开(公告)号:US20200176905A1
公开(公告)日:2020-06-04
申请号:US16614048
申请日:2018-05-15
Applicant: SAMTEC, INC.
Inventor: Jonathan E. BUCK
IPC: H01R12/73 , H01R12/71 , H01R12/72 , H01R13/514 , H01R13/6585 , H01R13/6471
Abstract: An electrical connector includes a substrate that includes a plurality of ground traces at first and second surfaces of the substrate, and a ground coupling assembly that couples pairs of ground traces at each of the first and second surfaces, and further couples the ground traces at the first surface to the ground traces at the second surface.
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公开(公告)号:US20190097357A1
公开(公告)日:2019-03-28
申请号:US15566504
申请日:2017-06-15
Applicant: Samtec, Inc.
Inventor: John A. MONGOLD , Jonathan E. BUCK
IPC: H01R13/6477 , H03H7/38 , H01R12/72 , H01R13/41
Abstract: An electrical connector includes first and second adjacent electrical contacts that each define respective first and second mating ends, the first mating end of a first one of the first and second adjacent electrical contacts defines a first contact surface, the second mating end of a second one of the first and second adjacent electrical contacts defines a second contact surface electrically isolated from the first contact surface; and a dielectric material positioned between the first and second adjacent electrical contacts. When a mating connector applies a force to the first contact surface and the second contact surface, the first and second mating ends and the dielectric material all move in a first direction.
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公开(公告)号:US20250107029A1
公开(公告)日:2025-03-27
申请号:US18973393
申请日:2024-12-09
Applicant: Samtec, Inc.
Inventor: Burrell G. BEST , Brian R. VICICH , Kevin R. MEREDITH , Chadrick P. FAITH , Istvan NOVAK , Jonathan E. BUCK
Abstract: A substrate reinforcement or stiffener can be toolless, slide-on, slide-off, and removable. A hold down can carry pre-attached solder balls, solder units, or fusible elements. Fusible elements can be shaped to reduce thermal and mechanical stresses when reflowed onto a substrate. A heat-producing article can include a heat-dissipation material selectively located on, or immediately adjacent to, a heat-producing article. Clips with a plurality of fingers can be added to power conductors. Graphene strips, graphene coatings, or nanomaterials can be applied to electrically non-conductive articles and are able to selectively direct unwanted heat away from the heat-producing article. Electro-magnetic interference can be reduced by selective placement of voids in a shield of an electrical component.
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公开(公告)号:US20240313451A1
公开(公告)日:2024-09-19
申请号:US18671033
申请日:2024-05-22
Applicant: Samtec, Inc.
Inventor: John A. MONGOLD , Jonathan E. BUCK , Jignesh H. SHAH , Chadrick P. FAITH , Randall E. MUSSER , Jean Karlo WILLIAMS BARNET , Norman S. MCMORROW
IPC: H01R12/79 , H01R13/518
CPC classification number: H01R12/79 , H01R13/518
Abstract: A cable connector system can include a board connector that attaches to a die package, a cable connector that attaches to the board connector, and a 1RU panel I/O connector attached to the cable connector.
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公开(公告)号:US20230155328A1
公开(公告)日:2023-05-18
申请号:US17995514
申请日:2021-04-08
Applicant: SAMTEC, INC.
Inventor: Jonathan E. BUCK
IPC: H01R13/6595 , H01R13/6586 , H01R13/6584
CPC classification number: H01R13/6595 , H01R13/6586 , H01R13/6584
Abstract: A high-speed electrical RF, single-ended, or differential/twin axial electrical connector, capable of at least 67 GHz of operable bandwidth. The electrical connector can include at least one signal conductor that is supported by a connector housing that, in turn, is received by an electrical shield. Two such electrical connectors are configured to mate with each other, such that a third electrical shield at least partially surrounds and contacts each of the first and second electrical shields, thereby placing the electrical shields in electrical communication with each other.
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公开(公告)号:US20200350731A1
公开(公告)日:2020-11-05
申请号:US16758579
申请日:2018-10-24
Applicant: SAMTEC, INC.
Inventor: Jonathan E. BUCK , John MONGOLD , Madhumitha RENGARAJAN
IPC: H01R13/6471 , H01R12/72 , H01R13/6474 , H01R43/20
Abstract: An electrical connector has a row of signal contacts, and a ground shield disposed inwardly from the signal contacts. Each of the signal and ground contacts has a first segment and a second segment. Each first segment defines a mounting end that can mount to a first electrical component, and each second segment defines a mating end that can mate with a second electrical component. The first and second segments of each signal contact and the ground contact are angularly offset from one another so as to define an angle of between 75 degrees and 105 degrees between the first and second segments. The first and second segments of each signal contact and the ground contact can be coupled to one another to define the angle. Alternatively, the signal and ground contacts can be bent along a common bend line that intersects the signal contacts and the ground contact.
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公开(公告)号:US20200185862A1
公开(公告)日:2020-06-11
申请号:US16789520
申请日:2020-02-13
Applicant: Samtec, Inc.
Inventor: John A. MONGOLD , Jonathan E. BUCK
IPC: H01R13/6477 , H03H7/38 , H01R13/41 , H01R12/72 , H01R13/646 , H01R13/514 , H01R13/631
Abstract: An electrical connector includes first and second adjacent electrical contacts that each define respective first and second mating ends, the first mating end of a first one of the first and second adjacent electrical contacts defines a first contact surface, the second mating end of a second one of the first and second adjacent electrical contacts defines a second contact surface electrically isolated from the first contact surface; and a dielectric material positioned between the first and second adjacent electrical contacts. When a mating connector applies a force to the first contact surface and the second contact surface, the first and second mating ends and the dielectric material all move in a first direction.
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公开(公告)号:US20250149834A1
公开(公告)日:2025-05-08
申请号:US18833466
申请日:2023-01-27
Applicant: SAMTEC, INC.
Inventor: Randall Eugene MUSSER , Jonathan E. BUCK , Madhumitha RENGARAJAN
IPC: H01R13/6587 , H01R12/72 , H01R13/6477
Abstract: An electrical connector includes a connector housing that supports a plurality of leadframe assemblies that include a ground plate and a signal wafer that abuts the ground plate. The signal wafer of one leadframe assembly is spaced from the ground plate of an adjacent signal wafer so as to define an air gap therebetween. A housing portion defines at least one, at least two, at least three or three or more discrete, adjustable skew correction areas, skew voids or respective air voids.
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公开(公告)号:US20230178917A1
公开(公告)日:2023-06-08
申请号:US18096605
申请日:2023-01-13
Applicant: Samtec, Inc.
Inventor: John A. MONGOLD , Jonathan E. BUCK , Jignesh H. SHAH , Chadrick P. FAITH , Randall E. MUSSER , Jean Karlo WILLIAMS BARNET , Norman S. MCMORROW
IPC: H01R12/79 , H01R13/518
CPC classification number: H01R12/79 , H01R13/518
Abstract: A cable connector system can include a board connector that attaches to a die package, a cable connector that attaches to the board connector, and a 1RU panel I/O connector attached to the cable connector.
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