Invention Publication
- Patent Title: ADHESIVE COMPOSITION, METHOD FOR PREPARING THE SAME, RETICLE ASSEMBLY INCLUDING THE SAME, AND METHOD FOR FABRICATING RETICLE ASSEMBLY INCLUDING THE SAME
-
Application No.: US18404861Application Date: 2024-01-04
-
Publication No.: US20240174902A1Publication Date: 2024-05-30
- Inventor: Mun Ja KIM , Byungchul YOO , Haeshin LEE , Chang Young JEONG , Yunhan LEE
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.,KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee: Samsung Electronics Co., Ltd.,KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee Address: KR Suwon-si; KR Daejeon
- Priority: KR 20200144447 2020.11.02
- The original application number of the division: US17516428 2021.11.01
- Main IPC: C09J129/04
- IPC: C09J129/04 ; C08K3/04 ; C08K3/36 ; C08K5/05 ; G03F1/64
Abstract:
An adhesive composition, a method for preparing the same, a reticle assembly including the same, and a method for fabricating the reticle assembly including the same are provided. The adhesive composition includes a polyphenol compound including tannic acid, a polymer including polyvinyl alcohol, and a solvent including water and alcohol.
Public/Granted literature
Information query
IPC分类:
