Invention Publication
- Patent Title: MAGNETIC POWDER, COMPOUND, MOLDED BODY, BONDED MAGNET, AND POWDER MAGNETIC CORE
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Application No.: US18551508Application Date: 2022-04-15
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Publication No.: US20240177897A1Publication Date: 2024-05-30
- Inventor: Kazumasa TAKEUCHI , Arisa TAIRA , Teruo ITOH , Hideo MAEDA , Chio ISHIHARA
- Applicant: Resonac Corporation
- Applicant Address: JP Tokyo
- Assignee: Resonac Corporation
- Current Assignee: Resonac Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP 21069756 2021.04.16
- International Application: PCT/JP2022/017908 2022.04.15
- Date entered country: 2023-09-20
- Main IPC: H01F1/057
- IPC: H01F1/057 ; H01F1/059 ; H01F1/26 ; H01F3/08

Abstract:
A magnetic powder includes: a plurality of magnetic particles including at least either one of a permanent magnet and a soft magnetic material; a first silicon compound covering at least a portion of the surfaces of the magnetic particles; and a second silicon compound covering at least a portion of the surfaces of the magnetic particles. The first silicon compound includes an alkyl group and silicon bonded to the alkyl group. The second silicon compound includes an alkyl chain, silicon bonded to one end of the alkyl chain, and a glycidyl group located at the other end of the alkyl chain. A number m of carbon atoms of the alkyl chain included in the second silicon compound is larger than a number n of carbon atoms of the alkyl group included in the first silicon compound.
Information query
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