An electronic device includes a substrate and a die having an active surface disposed on the substrate. A sensor is in communication with the active surface of the die. A ring encircles the sensor and includes a cylindrical wall and a cap, where the cap has a partial circular shape that extends beyond each side of the wall. A mold compound covers the die and abuts an outer surface of the wall thereby forming a cavity in the mold compound to expose the sensor to an environment external to the electronic device.