公开(公告)号：US20240178085A1

公开(公告)日：2024-05-30

申请号：US18070523

申请日：2022-11-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： STEVEN ALFRED KUMMERL ,  SREENIVASAN K. KODURI ,  SOPHIA DELPAK ,  LAURA MAY ANTIONETTE CLEMENTE

IPC: H01L23/24 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/24 ,  H01L21/56 ,  H01L23/3185 ,  H01L23/3192 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L23/49513

Abstract: An electronic device includes a substrate and a die having an active surface disposed on the substrate. A sensor is in communication with the active surface of the die. A ring encircles the sensor and includes a cylindrical wall and a cap, where the cap has a partial circular shape that extends beyond each side of the wall. A mold compound covers the die and abuts an outer surface of the wall thereby forming a cavity in the mold compound to expose the sensor to an environment external to the electronic device.