Invention Publication
- Patent Title: PERMANENT LAYER FOR BUMP CHIP ATTACH
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Application No.: US18071961Application Date: 2022-11-30
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Publication No.: US20240178097A1Publication Date: 2024-05-30
- Inventor: Frederick Atadana , Jean Bosco Kana Kana , Shripad Gokhale , Xavier F. Brun
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L21/48 ; H01L23/00 ; H01L23/15 ; H01L23/538 ; H01L25/065
Abstract:
Disclosed herein are microelectronics package architectures utilizing glass layers and methods of manufacturing the same. The microelectronics packages may include a silicon layer, dies, and a glass layer. The silicon layer may include vias. The dies may be in electrical communication with vias. The glass layer may include interconnects in electrical communication with the vias.
Information query
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