公开(公告)号：US20230378124A1

公开(公告)日：2023-11-23

申请号：US17750825

申请日：2022-05-23

Applicant: Intel Corporation

Inventor： Frederick Atadana ,  Jean Bosco Kana Kana

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L24/32 ,  H01L24/73 ,  H01L24/29 ,  H01L24/26 ,  H01L24/92 ,  H01L2224/32225 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/2919 ,  H01L2924/0665 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2924/05442 ,  H01L2224/83102 ,  H01L2224/83379 ,  H01L2224/83375 ,  H01L24/14 ,  H01L2224/14152 ,  H01L24/16 ,  H01L24/13 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/83009 ,  H01L2224/26122 ,  H01L2224/92125 ,  H01L24/81 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/8385 ,  H01L25/0655

Abstract: A microelectronic assembly comprises a first microelectronic component; a second microelectronic component under an area of the first microelectronic component and coupled to the first component through first interconnect structures within a central region of the area, and second interconnect structures within a peripheral region of the area, adjacent to the central region. A heterogenous dielectric surface on the first or second component or both and within a gap between the first and second components has a first surface composition within the central region and at least a second surface composition within the peripheral region.

公开(公告)号：US11842944B2

公开(公告)日：2023-12-12

申请号：US16727770

申请日：2019-12-26

Applicant: Intel Corporation

Inventor： Kyle Arrington ,  Frederick Atadana ,  Taylor Gaines ,  Minseok Ha

IPC: H01L23/373 ,  H01L23/367 ,  H01L21/48

CPC classification number: H01L23/373 ,  H01L21/4882 ,  H01L23/3675

Abstract: An integrated circuit (IC) assembly comprising an IC die and a frame material that has been dispensed over the assembly substrate to be further adjacent to a perimeter edge of the IC die. The frame material may be selected to have flow properties that minimize slump, for example so a profile of a transverse cross-section through the frame material may retain convex curvature. The frame material may be cured following dispense, and upon application of a thermal interface material (TIM), the frame material may and act as a barrier, impeding flow of the TIM. The frame material may be compressed by force applied through an external thermal solution, such as a heat sink, to ensure good contact to the TIM.

公开(公告)号：US20240178097A1

公开(公告)日：2024-05-30

申请号：US18071961

申请日：2022-11-30

Applicant: Intel Corporation

Inventor： Frederick Atadana ,  Jean Bosco Kana Kana ,  Shripad Gokhale ,  Xavier F. Brun

IPC: H01L23/373 ,  H01L21/48 ,  H01L23/00 ,  H01L23/15 ,  H01L23/538 ,  H01L25/065

CPC classification number: H01L23/3731 ,  H01L21/481 ,  H01L23/15 ,  H01L23/5384 ,  H01L23/5385 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: Disclosed herein are microelectronics package architectures utilizing glass layers and methods of manufacturing the same. The microelectronics packages may include a silicon layer, dies, and a glass layer. The silicon layer may include vias. The dies may be in electrical communication with vias. The glass layer may include interconnects in electrical communication with the vias.

公开(公告)号：US20210202348A1

公开(公告)日：2021-07-01

申请号：US16727770

申请日：2019-12-26

Applicant: Intel Corporation

Inventor： Kyle Arrington ,  Frederick Atadana ,  Taylor Gaines ,  Minseok Ha

IPC: H01L23/373 ,  H01L23/367 ,  H01L21/48

Abstract: An integrated circuit (IC) assembly comprising an IC die and a frame material that has been dispensed over the assembly substrate to be further adjacent to a perimeter edge of the IC die. The frame material may be selected to have flow properties that minimize slump, for example so a profile of a transverse cross-section through the frame material may retain convex curvature. The frame material may be cured following dispense, and upon application of a thermal interface material (TIM), the frame material may and act as a barrier, impeding flow of the TIM. The frame material may be compressed by force applied through an external thermal solution, such as a heat sink, to ensure good contact to the TIM.