Invention Publication
- Patent Title: RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES
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Application No.: US18071116Application Date: 2022-11-29
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Publication No.: US20240178119A1Publication Date: 2024-05-30
- Inventor: Mohammad Mamunur RAHMAN , Jeremy D. ECTON , Gang DUAN
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/00 ; H01L23/13 ; H01L23/15 ; H01L23/538
Abstract:
Embodiments disclosed herein include an interconnect. In an embodiment, the interconnect comprises a substrate and a pad over the substrate. In an embodiment, a hole is provided through the pad. In an embodiment, the hole exposes a portion of the substrate. In an embodiment, a solder is provided over the pad, and the solder bridges across the hole through the pad.
Information query
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