In examples, a semiconductor package comprises a semiconductor die including an ambient light sensor, the ambient light sensor facing a horizontal direction. The package includes first and second conductive terminals wirebonded to the semiconductor die, each of the first and second conductive terminals having first and second segments. The package includes a clear mold compound covering the semiconductor die and portions of the first and second conductive terminals. The first segments of the first and second conductive terminals extend vertically through the clear mold compound to an exterior of the clear mold compound, and wherein the second segments of the first and second conductive terminals are positioned exterior to the clear mold compound, extend horizontally in opposing directions, and are adapted to be coupled to a printed circuit board.