An electrode plate manufacturing apparatus includes a first coating device configured to apply a first active material coating on a first side of a current collector; a perforating device configured to perforate the current collector from a second side of the current collector, the second side being opposite to the first side; and a second coating device configured to apply a second active material coating on the second side of the current collector, where the perforating device is located downstream of the first coating device along a travel path of the current collector, and the second coating device is located downstream of the perforating device along the travel path of the current collector.